Babak Arfaei : rechercher sur Z-Library

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1

Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

Coyle, Richard J., Sweatman, Keith, Arfaei, Babak

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Année:

2015

Langue:

english

Fichier:

PDF, 8.27 MB

english, 2015

2

Emerging Interconnects and Pb-free Materials for Advanced Electronic Packaging

Cotts, Eric, Arfaei, Babak

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Année:

2015

Langue:

english

Fichier:

PDF, 307 KB

english, 2015

3

Erratum to: Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

Coyle, Richard J., Sweatman, Keith, Arfaei, Babak

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Année:

2017

Fichier:

PDF, 329 KB

2017

4

Advanced Characterization of Pb-Free Interconnects

Richard Coyle,Babak Arfaei

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Année:

2016

Langue:

english

Fichier:

PDF, 298 KB

english, 2016

5

Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue

Liang Yin, Luke Wentlent, Linlin Yang, Babak Arfaei, Awni Oasaimeh, Peter Borgesen

Journal:

Journal of Electronic Materials

Année:

2012

Langue:

english

Fichier:

PDF, 1.00 MB

english, 2012

6

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Reliability and failure mechanism of solder joints in thermal cycling tests

Arfaei, Babak, Mahin-Shirazi, Sam, Joshi, Shantanu, Anselm, Martin, Borgesen, Peter, Cotts, Eric, Wilcox, James, Coyle, Richard

Année:

2013

Langue:

english

Fichier:

PDF, 1.78 MB

english, 2013

7

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - The effect of nickel microalloying on thermal fatigue reliability and microstructure of SAC105 and SAC205 solders

Coyle, Richard, Parker, Richard, Arfaei, Babak, Mutuku, Francis, Sweatman, Keith, Howell, Keith, Longgood, Stuart, Benedetto, Elizabeth

Année:

2014

Langue:

english

Fichier:

PDF, 3.85 MB

english, 2014

8

Lead-Free Solders: Focus on Fundamentals, Reliability, and Applications

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Année:

2014

Langue:

english

Fichier:

PDF, 120 KB

english, 2014

9

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Failure mechanism and microstructural evolution of Pb-free solder alloys in thermal cycling tests: Effect of solder composition and Sn grain morphology

Arfaei, Babak, Mutuku, Francis, Coyle, Richard, Cotts, Eric, Wilcox, Jim

Année:

2015

Langue:

english

Fichier:

PDF, 1.87 MB

english, 2015

10

The Influence of Processing on Strengthening Mechanisms in Pb-Free Solder Joints

Francis Mutuku,Babak Arfaei,Eric J. Cotts

Journal:

Journal of Electronic Materials

Année:

2017

Langue:

english

Fichier:

PDF, 3.32 MB

english, 2017

11

Correlations Between the Microstructure and Fatigue Life of Near-Eutectic Sn-Ag-Cu Pb-Free Solders

Babak Arfaei, Eric Cotts

Journal:

Journal of Electronic Materials

Année:

2009

Langue:

english

Fichier:

PDF, 906 KB

english, 2009

12

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Dependence of solder joint reliability on solder volume, Composition and printed circuit board surface finish

Arfaei, Babak, Mutuku, Francis, Sweatman, Keith, Lee, Ning-Cheng, Cotts, Eric, Coyle, Richard

Année:

2014

Langue:

english

Fichier:

PDF, 3.59 MB

english, 2014

13

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Effect of microstructure evolution on Pb-free solder joint reliability in thermomechanical fatigue

Yin, Liang, Meilunas, Michael, Arfaei, Babak, Wentlent, Luke, Borgesen, Peter

Année:

2012

Langue:

english

Fichier:

PDF, 967 KB

english, 2012

14

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - The dependence of the Sn grain structure of Pb-free solder joints on composition and geometry

Parks, Gregory, Arfaei, Babak, Benedict, Michael, Cotts, Eric, Lu, Minhua, Perfecto, Eric

Année:

2012

Langue:

english

Fichier:

PDF, 868 KB

english, 2012

15

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Effect of variation in the reflow profile on the microstructure of near eutectic SnAgCu alloys

Mutuku, Francis, Arfaei, Babak, Cotts, Eric J

Année:

2014

Langue:

english

Fichier:

PDF, 2.73 MB

english, 2014

16

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Recrystallization behavior of lead free and lead containing solder in cycling

Qasaimeh, Awni, Jaradat, Younis, Wentlent, Luke, Yang, Linlin, Yin, Liang, Arfaei, Babak, Borgesen, Peter

Année:

2011

Langue:

english

Fichier:

PDF, 1.68 MB

english, 2011

17

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - On the evolution of the properties and microstructure of backward compatible solder joints during cycling and aging

Jaradat, Younis, Qasaimeh, Awni, Kondos, Pericles, Arfaei, Babak, Borgesen, Peter

Année:

2011

Langue:

english

Fichier:

PDF, 3.37 MB

english, 2011

18

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Reliability Assessment and Microstructure Characterization of Cu Pillars Assembled on Si and Glass Substrates

Genanu, Mohammed, Mutuku, Francis, Cotts, Eric J, Perfecto, Eric, Pollard, Scott, Shorey, Aric, Arfaei, Babak

Année:

2016

Langue:

english

Fichier:

PDF, 1.08 MB

english, 2016

19

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Effect of Processing Variables on the Mechanical Reliability of Copper Pillar SnAg Solder Joints

Genanu, Mohammed, Mutuku, Francis, Cotts, Eric J, Wilcox, James, Arfaei, Babak, Perfecto, Eric

Année:

2017

Langue:

english

Fichier:

PDF, 5.78 MB

english, 2017

20

Pb-Free Solder Joint Thermo-Mechanical Modeling: State of the Art and Challenges

Clech, Jean-Paul M., Coyle, Richard J., Arfaei, Babak

Journal:

Année:

2018

Langue:

english

Fichier:

PDF, 1.91 MB

english, 2018

21

Hurst Exponent Based Detection of High Impedance Dc Arc Events for 48 V Systems in Vehicles

Abdullah, Yousef, Shaffer, Jamie, Hu, Boxue, Hall, Bailey, Wang, Jin GAE, Emrani, Amin, Arfaei, Babak

Journal:

IEEE Transactions on Power Electronics

Année:

2020

Fichier:

PDF, 9.76 MB

2020